Low-temperature fast-curing epoxy resin adhesive and preparation method thereof 

（一种低温快速固化环氧树脂胶粘剂及其制备方法）

Inventor(s): WANG BINGXIN; WANG JUNJIAN; WANG HONGLEI 

Priority number(s): CN20151837791 20151126

Abstract of  CN105440998 (A)：

The invention discloses a low-temperature fast-curing epoxy resin adhesive and a preparation method thereof. The low-temperature fast-curing epoxy resin adhesive is prepared from 30%-60% of epoxy resin, 10%-20% of organic silicon resin, 6%-8.5% of modified nitrile rubber, 2%-4.5% of a catalyst, 2%-3% of a curing agent, 2%-3% of a flexibilizer, 16%-21% of inorganic filler and 2%-10% of modified filler. The inorganic filler comprises nano-montmorillonite, nano SiO2 and copper powder in the weight ratio being (5-10): (5-10): (8-11), and the modified filler comprises modified glass fiber and modified silicon carbide in the weight ratio being 7:3. The prepared epoxy resin adhesive can be used at the temperature of 30 DEG C and can be rapidly cured, the shearing strength reaches 30 MPa at the temperature of 15 DEG C, and the peeling strength reaches 8 kN/M at the temperature of 15 DEG C.