Urea formaldehyde resin adhesive for wood composite floor boards 

中国专利号Priority number：CN20151506787

Abstract：The invention relates to a urea formaldehyde resin adhesive for wood composite floor boards, which can be widely used for bonding high-grade composite floor boards, plywoods, medium-density fiberboards and the like. The urea formaldehyde resin adhesive for wood composite floor boards belongs to the technical field of artificial board adhesives. The urea formaldehyde resin is prepared from urea, formaldehyde and a modifier melamine, wherein the mole ratio of the urea to the formaldehyde is 1:(1.5-1.8), and the melamine accounts for 20-30% of the formaldehyde. The urea formaldehyde resin adhesive is prepared from the following raw materials in parts by weight: 100 parts of urea formaldehyde resin, 26-30 parts of modifying additive and 4-6 parts of microcapsulated curing agent. The product conforms to the national standard and international standard, and achieves or exceeds the quality of imported like products. The sample board detection proves that the formaldehyde release amount is 0.39 mg/L, and no adhesion failure occurs during impregnation and stripping. The urea formaldehyde resin adhesive has the advantages of lower production cost and simple composition, and can be pressed into three-layer wood composite floor boards made of various materials. The product has the advantages of high strength, low board formaldehyde content and high water resistance, and can completely substitute the imported adhesive powder.

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