Sika Automotive announces it has been nominated for the 2015 Altair Enlighten Award, the industry award dedicated to recognizing achievement in vehicle lightweighting.
Presented in collaboration with Center for Automotive Research (CAR) the Altair Enlighten Award recognizes achievement in weight reduction across the automotive industry from motorcycles to passenger cars, light trucks to commercial vehicles and buses.
This year,Sika Automotive’s Ultra-High Modulus Adhesive (UHM)for Mixed Material Bonding has been nominated along with 17 other breakthrough lightweighting technologies. The innovative adhesive, part of the Sikaflex automotive product family, a high modulus, fast cure adhesive material is currently used to bond the CFRP (Carbon Fiber Reinforced Plastic) Life Module to the aluminum chassis Drive Module on the BMW i3 and i8. The innovative adhesive is ideally suited to support the industry with a solution for the growing demand in mixed material bonding.
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