Engineered Material Systems is pleased to debut its 535-10M-45 UV Cured Epoxy Adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications. The material contains a secondary thermal cure initiator that cures as low as 90°C for shadowed areas.
535-10M-45 is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. The material is designed to eliminate any warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.
This new non-conductive UV cured adhesive cures rapidly when exposed to high intensity UV light. 535-10M-45 is a low outgassing, extremely flexible, high strength epoxy adhesive that does not contain antimony. It was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications. 535-18M-57 is the latest addition to Engineered Material Systems extensive line of electronic materials.
Engineered Materials Systems, Inc, is a global formulator and manufacturer of adhesives, conductives and encapsulants serving the appliance, automotive, filter, lighting, medical and microelectronics markets. For over 20 years, EMS has formulated state of the art acrylics, epoxies, silicones and urethanes. EMS’s goal is to fill a void in the industrial market utilizing materials for assembly. EMS believes all applications are unique and specific.
Source: Engineered Materials Systems
This document was provided by SpecialChems editor. If you want to share your press release, please send it to chief-editor-as@omnexus.com
本站所有信息与内容,版权归原作者所有。网站中部分新闻、文章来源于网络或会员供稿,如读者对作品版权有疑议,请及时与我们联系,电话:025-85303363 QQ:2402955403。文章仅代表作者本人的观点,与本网站立场无关。转载本站的内容,请务必注明"来源:林中祥胶粘剂技术信息网(www.adhesive-lin.com)".
©2015 南京爱德福信息科技有限公司 苏ICP备10201337 | 技术支持:南京联众网络科技有限公司