德路推出新型双固化环氧胶粘剂，在光照预处理后，60℃即能达到最终强度。新型环氧胶粘剂主要应用于电子行业。

　　这个系列的产品在较低温度时即可完成交联固化，比以前的产品快了三倍。新型粘合剂仅需半秒的光照预处理。在生产线上，这样快速的预处理是特别有利的，如此以来，在组件分配固定后，将被直接转移到工艺链的下一步，避免了生产线上该类组件的滑动，这样就保证了生产的重复性和快速性。

　　快,更快，再快-非常低的温度下固化

　　这款新型胶粘剂的固化温度很低，从而降低了材料之间的热应力。除此之外，他还可以毫无困难的应用在热敏基质的材料上，因为更高的温度只会损坏热敏元件。

　　对于这款纯低温固化胶粘剂而言，它仅需30分钟以及60度的低温就能实现最终强度。而目前为止，在相同的温度下，合格的同类产品是需要90分钟才能达到这个效果。这就使得德路的这款新产品成为其中最快的一种。而且他们仍然能够保持其良好的性能。

　　原文如下：

　　DELO has developed new dual-curing adhesives that reach full strength at only 60 °C after prefixation by light. The new range is completed by adhesives curing in a single step at low temperatures, three times faster than previous products. These epoxy resin-based adhesives are mainly used in electronics.

　　The new dual-curing adhesives from DELO can be prefixed after only half a second of exposure to light. Prefixing is particularly advantageous in the case of production lines, since, after dispensing and fixation, the component will be directly transferred to the next step of the process chain. This guarantees reproducibility and fast production, avoiding incidents like the slipping of individual components. Products of the DUALBOND family also feature excellent adhesion to LCP and allow adjustment of the adhesive properties ranging from flexible to hard (elongation at tear up to 70%).

　　Fast, faster, the fastest – very low temperature curing

　　The low curing temperature of these new adhesives reduces the thermal stress between the materials, thus limiting the stress on the component. In addition to that, they allow processing of temperature-sensitive substrates without difficulty: higher temperatures would only damage the sensitive components.

　　For purely low-temperature-curing adhesives, it only takes 30 minutes and a temperature of 60 °C to achieve their final strength. This makes them the fastest of their kind. So far, standard products have generally taken 90 minutes at the same temperature to achieve full strength. And still they are able to maintain their favorable properties such as their good adhesion to plastics like LCP, PA, and PPS or their flexibility on the component.