热熔压敏胶研究进展

刘  彤¹，张军营²，马解放¹，高江南¹，徐  丹¹，程  珏²，宋佳赟¹

（1.北京天宇航天新材料科技有限公司，北京  101407；2.北京化工大学材料科学与工程学院，北京 100020）

【摘  要】本研究综述了国内外SIS基热熔压敏胶和聚氨酯热熔压敏胶的研究进展。阐述了二者的优缺点、改性方法（如聚合改性、物理共混改性、化学改性）以及研究应用领域（如金属粘接、物流标签、建筑防水材料和医用胶粘剂等）进展，并对SIS基热熔压敏胶和聚氨酯热熔压敏胶的未来发展方向做了展望。

【关键词】改性SIS；聚氨酯；热熔压敏胶

聚酰亚胺基耐高温胶粘剂的研究进展

凤鹏举，唐富强，李靖辉，王艳军

（广州高新区能源技术研究院有限公司，广东广州  510670）

【摘  要】聚酰亚胺胶粘剂具有突出的耐高温性能、尺寸稳定性、物理和化学稳定性、介电性能及粘接性能，是综合性能优异的一类胶粘剂，因而受到了越来越多的关注。本文主要从分子结构的视角综述了经典（热塑性、热固性）聚酰亚胺胶粘剂、分子结构改造（分子主链结构改造、端基结构改造）的聚酰亚胺胶粘剂和共混改性的聚酰亚胺胶粘剂的研究进展，并对聚酰亚胺胶粘剂的未来发展趋势进行了展望。

【关键词】聚酰亚胺；胶粘剂；分子结构改造

液体丁腈橡胶增韧改性环氧树脂的研究进展

孟凡宁¹，王  彤²，易建军¹

（1.中国石油兰州石油化工有限公司研究院，甘肃兰州  730060；2.中国石油兰州石化公司合成橡胶厂，甘肃兰州  730060）

【摘  要】环氧树脂成本低廉、性能优异，应用范围广泛。目前研究人员多对其进行增韧改性，以弥补结构不足，进一步扩展其应用范围。其中，液体丁腈橡胶增韧改性环氧树脂是应用最成功的方法之一。本文简介了环氧树脂的增韧机理，综述了近年来各类液体丁腈橡胶，如端羧基液体丁腈（CTBN）、端羟基液体丁腈（HTBN）、无规羧基液体丁腈（XNBR）、液体丁腈（LNBR）、端胺基液体丁腈（ATBN）和端环氧基液体丁腈（ETBN）等增韧环氧树脂的研究进展，并对液体丁腈橡胶增韧环氧树脂的研究方向进行了展望。

【关键词】液体丁腈橡胶；增韧；环氧树脂；进展

无溶剂有机硅改性环氧电子胶的研究进展

胡良凯，虞鑫海

（东华大学化学与化工学院，上海  201620）

【摘  要】环氧树脂在电子领域有着广泛的应用，在环氧树脂中引入有机硅的Si—O—Si可改善环氧树脂脆而硬、耐候性差的缺点。本文综述了无溶剂有机硅改性环氧电子胶的改性方法、表征手段，介绍了目前国内外有机硅改性环氧树脂的一些研究进展和在电子领域（如灌封胶、LED密封胶、导电胶等）的应用，并展望了有机硅改性环氧树脂的未来发展方向。

含硼三烯丙基化合物改性环氧树脂的研究

袁志刚^1,2，刘  博¹，张  斌¹，孙明明¹，

张绪刚¹，薛  刚¹，宋彩雨¹，李坚辉¹，王  磊¹

（1.黑龙江省科学院石油化学研究院，黑龙江哈尔滨  150040；2.哈尔滨工程大学材料科学与化学工程学院，黑龙江哈尔滨  150001）

【摘  要】采用含硼三胺（TAB）和香草醛衍生的烯类化合物（AM）为原料，通过希夫碱合成反应设计制备了一种含硼三烯丙基化合物（TABM），通过改变TABM的添加量得到一系列改性树脂（E-51+TABM）。对固化后树脂的结构、热稳定性、热机械性能、拉伸剪切性能、阻燃性能以及微观断裂形貌进行了表征。研究结果表明：⑴红外光谱和核磁氢谱的测试结果均表明，成功地制备了目标产物TABM。⑵热稳定性和热机械性能研究表明，随着TABM用量的增加，固化后环氧树脂的储能模量和残碳率也随之增大，但其玻璃化转变温度和交联密度降低。这表明TABM的添加可以降低材料的刚性，提升环氧树脂的韧性。⑶添加TABM后，环氧树脂在室温和100 ℃条件下的拉伸剪切强度均得到提升，当添加10份TABM时，拉伸剪切强度在25 ℃的条件下提升了25.5%，在100 ℃的条件下提升了37.5%。⑷随着树脂中TABM含量的增加，固化后树脂的极限氧指数(LOI)值也随之提升，直到添加量达到20份时达到最大值，说明TABM的添加，使得固化后树脂的阻燃性得到了有效改善。⑸微观断裂形貌分析表明，共混树脂（E-51+TABM）的断裂韧性得到了提高。

【关键词】共聚改性；环氧树脂；热稳定性；热机械性能；剪切强度

双酚A型邻苯二甲腈树脂的合成及固化性能研究

丁楠洋^1,2，闫欣悦^1,2，张孝阿^1,2，张军营^1,2，王成忠^1,2

（1.北京化工大学材料科学与工程学院，北京  100029；2.碳纤维及功能高分子教育部重点实验室，北京  100029）

【摘  要】以双酚A和4-硝基邻苯二甲腈为原料，合成了双酚A型邻苯二甲腈树脂。然后利用傅里叶红外光谱（FT-IR）和核磁共振氢谱（¹H-NMR）表征了合成树脂的结构。以双酚A型邻苯二甲腈树脂为基体，筛选了过渡金属盐、芳香二胺、有机酚类等固化剂，通过差示扫描量热仪（DSC）研究了ZnCl₂、DBTDL、m-BAPS、DDM、4,4'-联苯二酚及各类复合固化剂对树脂的固化行为。研究结果表明：⑴成功合成了目标产物双酚A型邻苯二甲腈树脂单体。⑵在复合固化剂的组合中，ZnCl₂和DDM组成的无机金属盐/有机胺复合固化剂具有较高的固化反应活性，ZnCl₂和4,4'-联苯二酚组成的无机金属盐/有机酚复合固化剂以及DBTDL和4,4'-联苯二酚组成的有机金属盐/有机酚复合固化剂次之，DBTDL和DDM组成的有机金属盐/有机胺复合固化剂以及DDM/4,4'-联苯二酚组成的有机胺/有机酚复合固化剂的固化活性则较弱。⑶对比各类代表性催化剂、固化剂及其复合固化剂，以无机金属盐为代表的过渡金属盐催化剂及其复合固化剂具有最高的固化反应活性，有机胺类次之，有机酚类及其复合固化剂的反应活性较低。

【关键词】邻苯二甲腈树脂；合成；固化剂；固化性能

新型防弹环氧胶粘剂的研制与性能研究

李亚东，万传松，虞鑫海

(东华大学化学与化工学院，上海  201620)

【摘  要】采用两种环氧树脂、双马来酰亚胺、环氧扩链剂、固化剂、促进剂以及两种增韧剂，研制了系列无溶剂环氧胶粘剂体系，并对其性能进行了综合研究。研究结果表明：⑴4种不同配方的防弹环氧胶粘剂中，JC-4黏度适中，随温度升高而整体下降趋势均匀。当温度达到60 ℃以上时，黏度在400 mPa·s以内，便于对纤维涂敷。4种配方的环氧胶粘剂反应活性均较高，可在室温下进行固化且不会损伤UHMWPE纤维的性能。⑵4种配方的防弹环氧胶粘剂在中低温区均表现出优异的剪切强度，其中JC-3和JC-4配方的胶粘剂较为优异，在120 ℃仍具有11 MPa以上的剪切强度，表现出良好的耐高温稳定性，能够满足防弹复合材料对树脂基强度和耐热性基本需求。⑶4种配方的相对介电常数在3.9~4.5之间，均具有良好的介电性能，其中JC-4配方所制的环氧胶粘剂介电常数最低，具有良好的电绝缘性。JC-2、JC-3和JC-4的介电损耗在1.8%以内，表现出较优异的介质损耗稳定性。4种配方的环氧胶粘剂吸水率在0.36%~0.65%之间，均具有优异的疏水性能，其中JC-4配方胶粘剂吸水率最低仅为0.362%。⑷将JC-4配方用作防弹复合材料的胶粘剂，防弹复合材料在射击试验中，未被击穿，背弹面受弹头冲击而凸起，背凸高度为23 mm，能够满足防弹复合材料对胶粘剂的性能要求。

【关键词】耐高温；环氧树脂胶粘剂；防弹复合材料；胶粘剂性能

超支化水性光敏树脂的制备及其在3D打印中的应用研究

文鑫宇¹，杨文强¹，刘  觐¹，张栋祺¹，罗青宏¹，刘晓暄^1,2

（1.广东工业大学材料与能源学院，广东广州  510006；2.化学与精细化工广东省实验室揭阳分中心，广东揭阳  522000）

【摘  要】以柠檬酸（CA）和新戊二醇（NPG）合成了一种端羧基超支化聚酯（CHBP）。然后用甲基丙烯酸缩水甘油酯（GMA）对其进行改性，制备超支化水性聚酯丙烯酸酯（WCHBPA），并通过红外和核磁氢谱对其结构进行了表征。通过配方设计得到可水洗3D打印光敏树脂，探究了光引发剂（TPO-L）用量和辐照强度对复配树脂光固化动力学的影响。此外，还研究了超支化水性聚酯丙烯酸酯和丙烯酰吗啉（ACMO）质量比对3D打印样条的力学性能、玻璃化转变温度和热失重的影响。研究结果表明：⑴成功制备了目标产物CHBP和WCHBPA。⑵本研究复配了4种3D打印光敏树脂，黏度适宜，可满足3D打印的基本性能要求，在辐射光强为40 mW/cm²、TPO-L用量为2.0%（质量分数）的条件下，双键转化率达到最高。⑶随着稀释剂（ACMO）含量由30%增加到60%，固化样条的拉伸强度由13.3 MPa逐渐增大到45.6 MPa，冲击强度由2.98 kJ/m²降低至1.53 kJ/m²，玻璃化转变温度由92.4 ℃逐渐增大到151.1 ℃。⑷通过3D打印得到的制件呈现清晰且精度较好，对制备高性能可水洗3D打印光敏树脂及配方设计具有一定的参考意义。

【关键词】超支化；聚酯丙烯酸酯；水性；光敏树脂；紫外光固化；3D打印

某高导热绝缘胶在星载端机可靠性应用评价

张  晟，张晨晖，许培伦，金  星，刘志丹

（中国电子科技集团公司第二十研究所，陕西西安  710068）

【摘  要】针对星载端机对高导热绝缘底填胶可靠性应用需求，开展双组分高导热绝缘胶可靠性及环境适应性综合影响评估。通过导热绝缘胶性能测试标准样件，测试验证本征性能指标及工艺性指标，并分析评估其合格性；设计制作典型BGA菊花链网络结构样件，采用导热胶填充工艺技术，验证导热绝缘胶空洞率对BGA器件焊点的影响，评价其工艺适应性；设计制作星载端机载荷，开展星载产品验收级环境与可靠性试验，验证端机载荷具有经受工作应力和环境应力的能力。该高导热绝缘胶满足星载产品散热及抗高载荷的需求，实现可靠性应用。

【关键词】高导热绝缘胶；菊花链；焊点；空洞率；环境试验；可靠性

氯醚-丙烯酸酯树脂二级分散体的制备及性能研究

董群锋¹，牛红让¹，刘传奇¹，杨立峰¹，黄勇杰²，裴克梅²

（1.浙江天女集团制漆有限公司，浙江桐乡  314505；2.浙江理工大学化学与化工学院，浙江杭州  310018）

【摘  要】以氯醚树脂为改性树脂，通过溶液聚合方法合成了氯醚-丙烯酸酯树脂二级分散体。然后按照m（氯醚-丙烯酸酯树脂二级分散体）∶m（氨基树脂固化剂）=5∶1的比例制备了双组分水性涂料。探究了溶剂含量、反应温度、中和剂种类和中和度、羟基含量对二级分散体的影响，测试表征了改性树脂的分子结构和分散体的粒径，研究了氯醚-丙烯酸酯树脂水分散体及其双组分烘烤涂料的性能。研究结果表明：氯醚树脂改性丙烯酸树脂溶液的优化制备条件是，反应温度为90~100 ℃，反应时间为5 h，溶剂为丙二醇丁醚及乙二醇丁醚（含量为水分散体总质量的11%左右），引发剂为BPO，HPA作为交联功能单体；在最佳的合成条件下制备了氯醚树脂改性的丙烯酸酯水分散体，改性水分散体外观为乳白色泛蓝光，固含率约为48%，黏度为3 015 mPa·s，平均粒径为185 nm左右，(50±2) ℃/7 d的条件下贮存性稳定；与市售的羟基丙烯酸水分散体相比，本文制备的氯醚-丙烯酸酯树脂分散体的漆膜性能更优异。

【关键词】氯醚树脂；改性；丙烯酸酯树脂；二级分散体；性能

Research progress of hot melt pressure sensitive adhesive

Liu Tong¹, Zhang Junying²,Ma Jiefang¹, Gao Jiangnan¹, Xu Dan¹, Cheng Jue², Song Jiayun¹

(1.Beijing Tianyu Aerospace New Material Technology Co., Ltd., Beijing  101407, China; 2.College of Materials Science and Engineering, Beijing University of Chemical Technology, Beijing  100020, China)

【Abstract】The research progress of SIS-based hot melt pressure sensitive adhesive and polyurethane hot melt pressure sensitive adhesive at home and abroad was reviewed in this study. The advantages and disadvantages, modification methods (such as polymerization modification, physical blending modification, chemical modification), and research and application fields (such as metal bonding, logistics labels, building waterproofing materials, and medical adhesives) of both were elaborated, and the future development directions of SIS-based hot melt pressure sensitive adhesive and polyurethane hot melt pressure sensitive adhesive were also discussed.

【Keywords】modified SIS; polyurethane; hot melt pressure sensitive adhesive

Research progress of polyimide-based high-temperature resistant adhesive

Feng Pengju, Tang Fuqiang, Li Jinghui, Wang Yanjun

(Guangzhou High-Tech Zone Institute for Energy Technology Co., Ltd., Guangzhou 510670, Guangdong, China)

【Abstract】Polyimide adhesive has outstanding high-temperature resistance, dimensional stability, physical and chemical stability, dielectric properties, and bonding properties, making it a type of adhesive with excellent comprehensive performance, and therefore receiving increasing attention. In this paper, the research progress of classic (thermoplastic, thermosetting) polyimide adhesive, polyimide adhesive with molecular structure modification (molecular main chain structure modification, end group structure modification), and blend modified polyimide adhesive from the perspective of molecular structure was mainly reviewed, and the future development trend of polyimide adhesive was prospected.

【Keywords】polyimide; adhesive; molecular structure modification

Research progress on toughening modified epoxy resin with liquid nitrile rubber

Meng Fanning¹,Wang Tong²,Yi Jianjun¹

(1.Research Institute of Lanzhou Petrochemical Co., Ltd., PetroChina, Lanzhou  730060,Gansu, China; 2.Synthetic Rubber Plant of Lanzhou Petrochemical Company, PetroChina, Lanzhou 730060, Gansu, China)

【Abstract】Epoxy resin has low cost, excellent performance, and a wide range of applications. Currently, researchers are mostly modifying its toughness to compensate for structural deficiencies and further expand its application range. Among them, toughening modified epoxy resin with liquid nitrile rubber is one of the most successful methods in application. In this article, the toughening mechanism of epoxy resin was briefly introduced, the research progress of various liquid nitrile rubbers, such as carboxyl terminated liquid nitrile (CTBN), hydroxyl terminated liquid nitrile (HTBN), random carboxyl terminated liquid nitrile (XNBR), liquid nitrile (LNBR), amino terminated liquid nitrile (ATBN) and epoxy terminated liquid nitrile (ETBN) in toughening epoxy resin in recent years was reviewed, and the research direction of toughening epoxy resin with liquid nitrile rubber was prospected.

【Keywords】liquid nitrile rubber; toughening; epoxy resin; progress

Research progress of solventless silicone-modified epoxy electronic adhesive

Hu Liangkai, Yu Xinhai

（College of Chemistry and Chemical Engineering, Donghua University, Shanghai 201620, China）

【Abstract】Epoxy resin has a wide range of applications in the field of electronics. Introducing silicone-based Si—O—Si into epoxy resin can improve its brittleness, hardness, and poor weather resistance. In this article, the modification methods and characterization methods of solventless silicone-modified epoxy electronic adhesive were reviewed, some research progress of silicone-modified epoxy resins at home and abroad, and their applications in the electronic field (such as potting adhesive, LED sealant, conductive adhesive, etc.) were introduced, and the future development direction of silicone-modified epoxy resin was prospected.

【Keywords】epoxy resin; electronic adhesive; silicone; modification

Study on epoxy resin modified by boron-containing triallyl compounds

Yuan Zhigang^1,2, Liu Bo¹, Zhang Bin¹, Sun Mingming¹,

Zhang Xugang¹, Xue Gang¹, Song Caiyu¹, Li Jianhui¹,Wang Lei¹

（1.Institute of Petrochemistry Heilongjiang Academy of Sciences, Harbin 150040, Heilongjiang, China; 2. College of Materials Science and Chemical Engineering, Harbin Engineering University, Harbin  150001, Heilongjiang, China）

【Abstract】A boron-containing triallyl compound (TABM) was designed and prepared by Schiff base synthesis reaction using boron-containing triamine (TAB) and vanillin derived alkene compounds (AM) as raw materials. A series of modified resins (E-51+TABM) were obtained by changing the addition amount of TABM. The structure, thermal stability, thermomechanical properties, tensile shear properties, flame retardancy and microscopic fracture morphology of the cured resin were characterized. The research results showed that, ⑴ The test results of infrared spectroscopy and nuclear magnetic hydrogen spectroscopy both indicated that the target product TABM was successfully prepared. ⑵The research on thermal stability and thermomechanical properties showed that with the increase of TABM dosage, the storage modulus and residual carbon rate of cured epoxy resin also increased, but its glass transition temperature and crosslinking density decreased. This indicated that the addition of TABM could reduce the rigidity of the material and improve the toughness of epoxy resin. ⑶ After adding TABM, the tensile shear strength of epoxy resin was improved at both room temperature and 100 ℃. When 10 parts of TABM were added, the tensile shear strength increased by 25.5% at 25 ℃ and 37.5% at 100 ℃. ⑷ As the content of TABM in the resin increased, the limit oxygen index (LOI) value of the cured resin also increased, reaching its maximum value when the addition amount reached 20 parts, indicating that the addition of TABM effectively improved the flame retardancy of the cured resin. ⑸ The microscopic fracture morphology analysis showed that the fracture toughness of the blended resin (E-51+TABM) was improved.

【Keywords】copolymerization modification; epoxy resin; thermal stability; thermomechanical property; shear strength

Synthesis and curing properties of bisphenol A-type phthalonitrile resin

Ding Nanyang^1,2, Yan Xinyue^1,2, Zhang Xiao'a^1,2,Zhang Junying^1,2,Wang Chengzhong^1,2

(1.College of Materials Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, China; 2.Key Laboratory of Carbon Fiber and Functional Polymers of Ministry of Education, Beijing  100029, China)

【Abstract】Bisphenol A-type phthalonitrile resin was synthesized by using bisphenol A and 4-nitrophthalic acid as raw materials. Then, the structure of the synthesized resin was characterized by Fourier transform infrared spectroscopy (FT-IR) and nuclear magnetic resonance hydrogen spectroscopy (¹H-NMR). Transition metal salts, aromatic diamines, organic phenols, and other curing agents were screened by using bisphenol A-type phthalonitrile resin as the matrix. The curing behavior of ZnCl₂, DBTDL, m-BAPS, DDM, 4,4'-biphenol, and various composite curing agents on the resin was studied by differential scanning calorimeter (DSC). The research results showed that, ⑴ The target product, bisphenol A-type phthalimide resin monomer was successfully synthesized. ⑵ In the combination of composite curing agents, the inorganic metal salt/organic amine composite curing agent composed of ZnCl₂ and DDM had higher curing reaction activity, followed by the inorganic metal salt/organic phenol composite curing agent composed of ZnCl₂ and 4,4'-biphenol, and the organic metal salt/organic phenol composite curing agent composed of DBTDL and 4,4'-biphenol. The organic metal salt/organic amine composite curing agent composed of DBTDL and DDM and the organic amine/organic phenol composite curing agent composed of DDM/4,4'-biphenol had relatively weaker curing activity. ⑶Comparing various representative catalysts, curing agents and their composite curing agents, transition metal salt catalysts and their composite curing agents represented by inorganic metal salts had the highest curing reaction activity, followed by organic amines, and organic phenols and their composite curing agents had relatively lower reaction activity.

【Keywords】phthalonitrile resin; synthesis; curing agent; curing property

Development and performance study of new bulletproof epoxy adhesive

Li Yadong, Wan Chuansong, Yu Xinhai

(College of Chemistry and Chemical Engineering, Donghua University, Shanghai 201620, China)

【Abstract】A series of solvent-free epoxy adhesive systems were developed by using two kinds of epoxy resin, bismaleimide, epoxy chain extender, curing agent, accelerator, and two kinds of toughening agent, and their properties were comprehensively studied. The research results showed that, ⑴ Among the four different formulations of bulletproof epoxy adhesive, JC-4 had a moderate viscosity and a uniform overall downward trend with increasing temperature. When the temperature reached 60 ℃ or above, the viscosity was within 400 mPa·s, which facilitated fiber coating. The four formulations of epoxy adhesive had high reactivity, and could be cured at room temperature without damaging the performance of UHMWPE fiber. ⑵ The four formulations of bulletproof epoxy adhesive showed excellent shear strength in the medium and low temperature range, among which the adhesive of JC-3 and JC-4 formulations exhibited superior shear strength of over 11 MPa at 120 ℃, demonstrating good high-temperature stability and meeting the basic requirements of resin based strength and heat resistance for bulletproof composite materials. ⑶ The relative dielectric constants of the four formulations were between 3.9 and 4.5, all of which had good dielectric properties. Among them, the epoxy adhesive prepared by JC-4 formulation had the lowest dielectric constant and good electrical insulation properties. The dielectric loss of JC-2, JC-3, and JC-4 was within 1.8%, demonstrating excellent stability in dielectric loss. The water absorption rate of the four formulations of epoxy adhesive ranged from 0.36% to 0.65%, all of which had excellent hydrophobic properties. Among them, the JC-4 formulation adhesive had the lowest water absorption rate of only 0.362%. ⑷ The JC-4 formulation was used as the adhesive for bulletproof composite materials. The bulletproof composite materials were not penetrated during the shooting test, and the back surface was raised by the impact of the bullet, with a height of 23 mm, which could meet the performance requirements of the adhesive for bulletproof composite materials.

【Keywords】heat-resistance; epoxy resin adhesive; bulletproof composite material; adhesive property

Preparation of hyperbranched waterborne photosensitive resin and its application in 3D printing

Wen Xinyu¹,Yang Wenqiang¹,Liu Jin¹,Zhang Dongqi¹,Luo Qinghong¹,Liu Xiaoxuan^1,2

(1.School of Materials and Energy, Guangdong University of Technology, Guangzhou510006, Guangdong, China; 2.Guangdong Laboratory of Chemistry and Fine Chemical Industry Jieyang Center, Jieyang  522000, Guangdong, China)

【Abstract】A carboxyl terminated hyperbranched polyester (CHBP) was synthesized by using citric acid (CA) and neopentyl glycol (NPG), and then it was modified with glycidyl methacrylate (GMA) to prepare hyperbranched waterborne polyester acrylate (WCHBPA). Its structure was characterized by infrared and nuclear magnetic hydrogen spectroscopy. A washable 3D printed photosensitive resin was obtained through formula design, and the effects of the dosage and irradiation intensity of the photoinitiator (TPO-L) on the photopolymerization kinetics of the composite resin were investigated. In addition, the influence of the mass ratio of hyperbranched waterborne polyester acrylate and acryloylmethiolane (ACMO) on the mechanical properties, glass transition temperature, and thermal weight loss of 3D printed splines was also studied. The research results showed that, ⑴ The target products CHBP and WCHBPA were successfully prepared. ⑵ In this study, four types of 3D printing photosensitive resins with suitable viscosity were formulated, which could meet the basic requirements of 3D printing. Under the conditions of radiation intensity of 40 mW/cm² and TPO-L dosage of 2.0% (mass fraction), the conversion rate of double bonds reached the highest. ⑶ As the content of diluent (ACMO) increased from 30% to 60%, the tensile strength of the cured sample gradually increased from 13.3 MPa to 45.6 MPa, the impact strength decreased from 2.98 kJ/m² to 1.53 kJ/m², and the glass transition temperature gradually increased from 92.4 ℃ to 151.1 ℃. ⑷ The parts obtained through 3D printing were clear and accurate, which had certain reference significance for the preparation of high-performance washable 3D printing photosensitive resins and formula design.

【Keywords】hyperbranched; polyester acrylate; waterborne; photosensitive resin ; UV curing; 3D printing

Evaluation of the reliability application of a high thermal conductivity insulating adhesive in the satellite-borne terminal machine

Zhang Sheng, Zhang Chenhui, Xu Peilun, Jin Xing, Liu Zhidan

(China Electronics Technology Group Corporation No.20th Research Institute, Xi'an 710068, Shaanxi, China)

【Abstract】In response to the reliability application requirements of high thermal conductivity insulating underfill adhesive for satellite-borne terminal machine, a comprehensive impact assessment on the reliability and environmental adaptability of two-component high thermal conductivity insulating adhesive was conducted. The intrinsic performance indicators and processability indicators were tested and verified through standard samples of thermal conductivity insulating adhesive performance testing, and their qualifications were analyzed and evaluated as well. Typical BGA daisy-chain network structure samples were designed and produced, and by using thermal conductive adhesive filling technology, the effect of void ratio of thermal conductivity insulating adhesive on BGA device solder joints was verified and its process adaptability was also evaluated. Satellite-borne terminal loading was designed and manufactured, and acceptance-level environmental and reliability tests on satellite-borne products were conducted, in order to verify that the terminal loading had the ability to withstand working and environmental stresses.This high thermal conductivity insulating adhesive met the requirements of heat dissipation and high load resistance for satellite-borne products, achieving reliable applications.

【Keywords】high thermal conductivity insulating adhesive; daisy-chain; solder joint; void rate; environmental test; reliability

Preparation and performance study of secondary dispersion of chloroether-acrylic resin

Dong Qunfeng¹, Niu Hongrang¹, Liu Chuanqi¹, Yang Lifeng¹, Huang Yongjie²,Pei Kemei²

(1. Zhejiang Tiannu Group Paint Co., Ltd., Tongxiang 314505, Zhejiang, China; 2. School of Chemistry and Chemical Engineering, Zhejiang SCI-TECH University, Hangzhou  310018, Zhejiang, China）

【Abstract】The secondary dispersion of chloroether-acrylic resin was synthesized by solution polymerization method using chloroether resin as a modified  resin. Then, the two-component water-based coating was prepared in a ratio of m(chlorinated ether-acrylic resin secondary dispersion) : m(amino resin curing agent)=5:1. The effects of solvent content, reaction temperature, neutralizer type and neutralization degree, and hydroxyl content on the secondary dispersion were explored. The molecular structure of the modified resin and the particle size of the dispersion were tested and characterized. The properties of chloroether-acrylic resin aqueous dispersion and its two-component baking coating were studied. The research results showed that, the optimized preparation conditions for chloroether resin modified acrylic resin solution were the reaction temperature of 90-100 ℃, the reaction time of 5 hours, solvents of propylene glycol butyl ether and 2-butoxyethanol (with the content of about 11% of the total mass of the aqueous dispersion), initiator of BPO, and HPA as crosslinking functional monomer.Under the optimal synthesis conditions, the chloroether resin modified acrylic ester aqueous dispersion was prepared. The modified aqueous dispersion had a milky white appearance with blue light, the solid content of about 48%, the viscosity of 3 015 mPa • s, the average particle size of about 185 nm, and stable storage at (50±2) ℃/7 days. Compared with commercially available hydroxy acrylic acid aqueous dispersion, the coating film properties of the chloroether-acrylic resin dispersion prepared in this article were more superior.

【Keywords】chloroether resin; modification; acrylic resin; secondary dispersion; property