Nano silicon dioxide modified phenolic resin wood adhesive 

Application number:CN20141796759

Abstract：The invention discloses a nano silicon dioxide modified phenolic resin wood adhesive comprising the following components by mass: 27%-30% of formaldehyde, 15%-25% of phenol, 6%-12% of polyvinyl alcohol, 0.5%-2% of alkyl phenol polyoxyethylene ether, 2%-6% of a blocked water-based isocyanate crosslinking agent, 1%-3% of polyvinylpyrrolidone, 6%-10% of styrene-acrylic latex, and 20%-30% of nano silicon dioxide, and the particle size of the nano silicon dioxide is in 20-80 nm range. The beneficial effect is that compared with the prior art, the nano silicon dioxide modified phenolic resin wood adhesive has high adhesive strength, good water resistance, high toughness, low toxic component content, low cost, good using effect, and other characteristics.

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