Master Bond launches Master Bond EP54TC, a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical.
Featuring the highest thermal conductivity in the Master Bond electrically insulating portfolio - exceeding 6 W/(m·K) - it delivers exceptional heat dissipation while remaining electrically non-conductive and compliant with ASTM E595 NASA low outgassing requirements.
Supports thin bond lines and maximize thermal performance
Formulated with a specialty filler featuring a particle size range of 5 - 30 microns, Master Bond EP54TC supports thin bond lines and efficient void filling to maximize thermal performance. It offers an exceptionally low thermal resistance of 5–7 × 10-6 K·m2/W and a high tensile modulus exceeding 1,000,000 psi at room temperature. This robust system is serviceable from –100°F to +400°F (–73°C to +204°C) and, when post-cured, achieves a glass transition temperature of 70–80°C and a Shore D hardness of 85–95.
Master Bond EP54TC is a moderate heat cured system, with a recommended schedule of 2 hours at 80°C followed by a 2–4 hour post cure at 90–125°C. The mixed material features a viscosity of 100,000–200,000 cps and offers a manageable working life of 60–90 minutes at ambient temperature. To accommodate both research and large-scale manufacturing, Master Bond EP54TC is available for purchase in ounce, half-pint, pint, quart, and gallon kits.
Still not sure if this is the right grade for you? We’ve got you covered! Over 80+ epoxy resins from Master Bond are available for selection!
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