加载中...

点击这里给我发消息

QQ群:417857029

期刊专利论文

一种用于LED芯片封装的改性环氧树脂导电胶黏剂

来源:互联网2018年04月03日

阅读次数:

Modified epoxy resin conductive adhesive used for LED chip packaging  

Inventor(s): WANG XIAODONG:

Application number: CN20141615134 20141105

Abstract of  CN105623585 (A):

The invention discloses a modified epoxy resin conductive adhesive used for LED chip packaging. The modified epoxy resin conductive adhesive comprises the following raw materials by mass percentage: 20-25% of modified epoxy resin, 30-45% of nano silver powder, 10-15% of nano copper powder, 10-15% of silicon dioxide, 5-8% of zinc stearate, 1-2.5% of a coupling agent, 2-3% of a plasticizer, 1-2% of a curing agent, 0-1% of a curing accelerator, and 0-8% of diluents. According to the modified epoxy resin conductive adhesive used for LED chip packaging, by adding nano silver powder and nano copper powder with different proportion in the conductive adhesive, a proper of the modified epoxy resin is cooperated, high heat conductivity and high conductivity are realized, the modified epoxy resin conductive adhesive has superior performance, has good heat conduction and conductive effects, and can fully satisfy the usage requirement of high-brightness large-power LED chips.

 

  • 标签:
相关阅读

本站所有信息与内容,版权归原作者所有。网站中部分新闻、文章来源于网络或会员供稿,如读者对作品版权有疑议,请及时与我们联系,电话:025-85303363 QQ:2402955403。文章仅代表作者本人的观点,与本网站立场无关。转载本站的内容,请务必注明"来源:林中祥胶粘剂技术信息网(www.adhesive-lin.com)".

网友评论

©2015 南京爱德福信息科技有限公司   苏ICP备10201337 | 技术支持:南京联众网络科技有限公司

客服

客服
电话

1

电话:025-85303363

手机:13675143372

客服
邮箱

2402955403@qq.com

若您需要帮助,您也可以留下联系方式

发送邮箱

扫二
维码

微信二维码