Master Bond Unveils Epoxy-based, Dual Curing Adhesive for Bonding & Sealing Applications
Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~ 23°C). It provides outstanding dimensional stability and superior physical strength properties. Additionally, UV22DC80-10F is optically clear and offers the ability to be cured in shadowed out areas.
Rohit Ramnath, Senior Product Engineer:
“It is designed to cure in 10-30 seconds at 365nm with 10-40 mW/cm2 of UV output, followed by a post cure at 180°F (~ 80°C) for 30-60 minutes. This system has been specially designed for applications involving heat sensitive components. The product is serviceable from -60°F to 350°F (-51°C to 177°C) and it offers a lower coefficient of thermal expansion 30-35 x 10-6 inch/inch/°C compared to other UV curing systems.”
Master Bond UV22DC80-10F is 100% solids and is not oxygen inhibited. It is capable of curing up to thicknesses of around 0.050 inches. The product can be used for bonding, sealing, coating and glob-top type applications. It has a refractive index of 1.52 at 589 nm. It is available for purchase in 10 cc and 30 cc syringes, ounce jars, ½ pint, 1 pint, and quart containers. The shelf life at 40-50°F is 6 months in the original unopened containers.
Master Bond Dual Cure Adhesives
Master Bond UV22DC80-10F is a one part dual UV and heat cure system with unique flow characteristics. It features optical clarity, excellent bond strength, thermal stability and convenient, easy application.
Thixotropic low viscosity
Minimal shrinkage upon curing
Superb optical clarity
Cures at 80°C in shadowed out areas
One component system; no mixing needed
Dual curing mechanism allows for curing in shadowed out areas and rapid fixturing time at 80°C
No oxygen inhibition
Very low shrinkage upon curing
Superior physical strength and temperature resistance
Nano filled, high dimensional stability